Consumer electronics innovation conference to kick off Oct. 22

The 2026 Consumer Electronics Innovation Conference (CEIC2026) is set to take place in Hall 9 of the Shenzhen Convention & Exhibition Center in Futian District from Oct. 22 to 24. 

Themed “Innovation for Infinity,” the event is co-hosted by the Hetao International Organization Headquarters (HIOH) and the Center for International Economic and Technological Cooperation of the Ministry of Industry and Information Technology (CIETC), said Yang Tao, executive deputy director of the CEIC Organizing Committee, at a press conference yesterday.

This year’s 20,000-square-meter exhibition will bring together more than 300 leading technology companies and emerging innovators, focusing on audiovisual technologies, AI computing, semiconductors, next-generation connectivity, smart devices, intelligent mobility and smart living. Leading tech companies, including China Media Group, China Mobile, Huawei, Honor, Lenovo, Midea, XPENG and HiSilicon, will showcase their latest achievements and technologies.

The conference will feature high-end forums and more than 20 sub-forums, with leading experts and representatives from international organizations including the International Electrotechnical Commission, the International Telecommunication Union and the European Telecommunications Standards Institute. CEIC2026 aims to serve as a major consumer electronics innovation platform and industry gateway in the Asia-Pacific region.

A series of global and industry-first innovations will debut at CEIC2026. Highlights include the world’s first spatial imaging standard from the UHD World Association, new developments in AI computing and foundation models, SparkLink 2.0 chips, the first public presentation of SparkLink 3.0 technologies for the AI era, and the "Network 2030 Research Report."

The event will also feature dedicated innovation zones and activities, including Innovation PARK, Vivid Immersive Park, the third Sparklink & OpenHarmony Cup Innovation Game, and an Open Stage in collaboration with Shenzhen Media Group.

For the first time, future intelligent mobility will become a major focus of CEIC2026, bringing together companies including EHang, ZEROG Aircraft Industry and Huawei Intelligent Automotive Solution to showcase eVTOL aircraft, advanced smart cockpits and vehicle-to-everything connectivity solutions. Li Niejun, CMO of ZEROG, said the company would attend with three goals: to learn the standards, connect with the ecosystem, and find partners.

Zeng Guosong, secretary-general of the International SparkLink Alliance (iSLA), said the rapid growth of AI agents and embodied intelligent devices has made innovation in underlying wireless connectivity increasingly important to the intelligent upgrade of consumer electronics.

With 2026 marking the first year of China’s 15th Five-Year Plan period, CEIC2026 will focus on intelligent, green and integrated development, as well as core technologies, innovation and standards, while highlighting emerging trends in consumer electronics across a range of application scenarios, according to Sun Huaqing, deputy director of CIETC.

CEIC2026 will bring together innovators, industry professionals and consumers in Shenzhen to explore emerging technologies and experience new products in consumer electronics.