Explore future tech at two fairs in Bao'an

From Aug. 26 to 28, the Shenzhen World Exhibition & Convention Center in Bao’an District is hosting two fairs that bring together leading companies in the power electronics supply chain and additive manufacturing (AM) to showcase their latest technologies and applications.

PCIM Asia Shenzhen and Formnext Asia Shenzhen are underway at the Shenzhen World Exhibition & Convention Center from Aug. 26 to 28. Photos by Li Dan

PCIM Asia Shenzhen, part of Asia’s leading event series for power electronics, is being held in halls 14 and 16, covering 30,000 sqm of exhibition space and featuring 271 leading companies. In addition to industry leaders such as Mitsubishi Electric, Infineon, Semikron Danfoss, Fuji Electric, and ROHM, the event also hosts 10 top universities.

A view of Hall 16 at the Shenzhen World Exhibition & Convention Center, where PCIM Asia Shenzhen is being held.

The fair’s concurrent program includes two summits that are discussing industry cycles, strategies for global markets, power semiconductor process technologies, and full-stack solutions for AI data centers. There are also 11 theme forums and four co-organized forums focusing on specific technologies and their applications.

The concurrent PCIM Asia Shenzhen Conference features 131 research presentations, exploring power electronics research and applications in e-mobility, AI data centers, and renewable energy. Scholars from Zhejiang University, Xi’an Jiaotong University, Tsinghua University, and Hefei University of Technology, along with industry representatives from Infineon, Mitsubishi Electric, Schneider Electric, and Delta, are giving keynote speeches. The conference will also present four awards to recognize innovation and emerging talent in the sector. 

A visitor examines a 3D‑printed precision part for a machine in Hall 15.

Meanwhile, in Hall 15, Formnext Asia Shenzhen covers 20,000 sqm and gathers 330 exhibitors in additive manufacturing, more commonly known as 3D printing.

The show floor brings together materials, printers and hardware, software, inspection tools, and post-processing equipment for industrial 3D printing, with leading companies such as Addireen, AmPro, Avimetal AM, Bambu Lab, Bright Laser Technologies, CNPC, and Creality returning to the fair. Many others are making their debut, including EPSON, GLB, GS-Eagle Intelligent, HanSun, and Hi 3D.

Two receptionists stand at the booth of Han’s Matrix3D.

The fair has expanded its coverage of desktop additive manufacturing through the 3D Print Farm and Consumer Products Zone. The number of exhibitors participating in the zone has doubled compared with last year. Visitors can find desktop printers, materials, software, and production solutions for individual users, product developers, print farms, and small-scale manufacturers.

International exhibitors from Germany, Japan, Singapore, and the U.S. are taking part, while an international pavilion brings together companies from France, Germany, South Korea, and Spain.

A visitor shows interest in a pair of 3D‑printed footwear.

The fringe program features 12 forums and other activities, including five new additions that explore new opportunities for additive manufacturing across Asia. Topics include applications for AI and data centers, robotics and embodied intelligence, and commercial aviation and aerospace, as well as 3D-printed footwear and Shenzhen’s growing desktop AM ecosystem.

The Formnext Asia Shenzhen Maker Day, co-organized with TroubleMaker, includes open-mic sessions, curated exhibitor tours, and off-site factory visits, while a business matching event is bringing Chinese AM companies together with international distributors, dealers, and channel partners.

The fair is also debuting the International 3D Printed Footwear Design Awards, whose winners will be chosen by a panel of international judges led by Nicoline van Enter, founder of Footwearology, an international innovation and education platform for the footwear industry.